Indium, a versatile metal, finds diverse applications. It enhances electronics through soldering and semiconductor production, enables touchscreens and flat-panel displays with transparent conductive coatings, and serves aerospace with its high-temperature resistance. Indium’s adaptability fuels technological advancements across industries.

Indium bonding, also known as indium soldering or indium bump bonding, is a specialized bonding technique used in semiconductor packaging and other high-tech applications. It involves using indium metal to create a strong and reliable electrical and/or thermal connection between two surfaces or components. Indium bonding is commonly used for applications where a high level of thermal conductivity and electrical connectivity is required, such as in microelectronics, photonics, and certain scientific instruments.