greg.fletcher@pioneer-advmat.com
Call Us
+1-970-739-0393
greg.fletcher@pioneer-advmat.com
+1-970-739-0393
PAMI provides bonding channels and services for our customers worldwide. PAMI is also capable of making various types of backing plate to be bonded with PAMI’s targets. The backing plate materials could be Cu, CuCr, or Mo type, as well as other special backing plate surface metallization requirements.
Our bonding is of the highest quality at a very competitive price.
We offer local bonding services for Taiwan and North America.
We utilize ultra-sonic bonding techniques to minimize incorporation of oxides and voids at the critical bonding interface. Oxides/voids can cause localized heating which can result in ununiform heat and eventual debonding. We can use either solder or elastomer that sits tightly between the target material and the backing plate, giving it superior thermal as well as electrical performance.
Whether you seek technical consultations or have inquiries about our advanced materials, we are here to assist you. Let’s collaborate to bring your innovative ideas to life. Contact us today and pave the way for technological evolution.
+1-970-739-0393
greg.fletcher@pioneer-advmat.com
3357 Candlewood Road Torrance, CA 90505 USA
+1-970-739-0393
Copyright 2025 Pioneer Advanced Materials Inc.
Web Design and Development by 24Webstudio